On August 30, 2020, the kick-off meeting on the consulting and evaluation project of the academic department of the Chinese Academy of Sciences: the current situation and development of China's electronic electroplating foundation and industry was held in Shanghai Electric Power University. Famous experts and scholars in this field from all over the country participated in the kick-off meeting under the auspices of Academician Sun Shigang.

All along, the important fact that all kinds of electronic products are inseparable from the support of electroplating technology has been ignored. It is an indisputable fact that a large number of intelligent electronic products, including chip manufacturing, increasingly need the support of electronic electroplating technology.

Recently, there has been constant friction between China and the United States, among which the blockade of high-end chip technology by the United States is particularly prominent. The situation is quite urgent, and it is imperative to build a full industrial chain of core products such as Chinese chip manufacturing. A powerful link in this important industrial chain is electronic electroplating. As an electrodeposition technology (commonly known as electroplating) that can control electrons to enter the ion space orbit to achieve atomic level metal reduction and assemble crystals, it is the only technology that can cope with increasingly fine wafer high-density semiconductor interconnection.

However, the electronic chemicals used for chip electroplating have been using imported foreign technologies, which is extremely unfavorable for the development of the whole industrial chain with our own intellectual property rights. In view of this situation, Academician Sun Shigang, on the basis of the development of electrochemical process and industry research in recent years, proposed the issue of further consultation and evaluation of the current situation and development of electronic electroplating, which was supported by the academic department of the Academy of Sciences and became an official consultative project, and successfully achieved its start. The release of this information has brought important benefits to China's electronic electroplating industry and is a great inspiration to enterprises and scientific and technological personnel engaged in electronic electroplating.

As mentioned above, China's modern manufacturing has become stronger and stronger, and electroplating manufacturing has increasingly penetrated into high-tech fields. Edison also noted that customers' requirements for product electroplating are becoming more and more high-end. For example, the current silver plating of 5G base station ceramic filters, the micro hole gold plating of the customer's chip from Helin Technology Company, etc. are all industry problems that need to be solved. Although Edison has been immersed in the electroplating industry for a long time, it is deeply aware of its own technical limitations and its responsibility to contribute to the development of national science and technology, So on July 17, we established an industry university research cooperation base with Shanghai University, a well-known university. Edison should constantly increase R&D investment, strengthen the construction of R&D team, design the most reasonable production process and coating structure according to the use requirements of customers' products, and solve the problems in the electroplating field.

Ma Yun: "For 5000 years, the Chinese people have not been afraid of any challenges, because each time we are stronger." The Chinese nation is a great nation. It is our label to be hardworking and able to endure hardships. After just 40 years of reform and opening up, China will certainly go further now!

The rise of China's manufacturing industry requires a large number of enterprising Chinese enterprises to strive for it! Aidisheng electroplating will surely become the preferred supplier of global functional electroplating (gold silver tin)!